CyberPowerPC Microphone MPC603EC Manual do Utilizador descarregar pdf (Página 19)

603 Hardware Specifications, REV 2 19

Preliminary—Subject to Change without Notice

1.6.2 IBM C4-CQFP Package Description

The following sections provide the package parameters and mechanical dimensions for the IBM C4-CQFP

package.

1.6.2.1 Package Parameters

The package parameters are as provided in the following list. The package type is 32 mm x 32 mm, 240-pin

ceramic quad ﬂat pack.

Package outline 32 mm x 32 mm

Interconnects 240

Pitch 0.5 mm

Lead plating Ni Au

Solder joint Sn/PB (10/90)

Lead encapsulation Epoxy

Solder-bump encapsulation Epoxy

Maximum module height 3.1 mm

Co-planarity speciﬁcation 0.08 mm

Note: No solvent can be used with the C4-CQFP package. See Appendix A, “General Handling

Recommendations for the IBM Package,” for details.

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CyberPowerPC Microphone MPC603EC Manual do Utilizador Página 19